Semiconductor device and method for producing same

ABSTRACT

A semiconductor device having a substrate, an insulating film formed in the substrate, a conductive layer formed on the insulating film and having at least a part in contact with the insulating film made of a conductive material having a work function near a substantial center of an energy band gap of the substrate material and containing a predetermined amount of impurity, and a takeout electrode formed in the substrate and a method for producing the same.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a semiconductor device and a method for producing the same, more particularly relates to a semiconductor device having a conductive layer in which a work function of a conductive material located at a boundary with an insulating film formed on a substrate is controlled to near the substantial center of an energy band gap of a substrate material, that is, the “mid-gap”, and to a method for producing the same.

[0003] 2. Description of the Related Art

[0004] In semiconductor devices in recent years, complete separation among elements has become easy by using a silicon-on-insulator or semiconductor-on-insulator (SOI) substrate as the substrate. Further, it is known that, if such an SOI substrate is used, the control of the latchup and the software error peculiar to a complementary metal oxide semiconductor (MOS) transistor (CMOSTr) becomes possible, so studies have been conducted on the increase of speed and increase of reliability of large-scale integrated circuits (LSIs) comprised of CMOSTrs using SOI substrates having silicon (Si) active layers of a thickness of about 500 nm from a relatively early stage.

[0005] Further, recently, it has been learned that if the Si active layer of the SOI substrate surface is made further thinner to about 100 nm and the impurity concentration of a channel region is controlled to be relatively low to make substantially the entire Si active layer depleted (make it a full depletion type), excellent characteristics such as suppression of a short channel effect and improvement of a current driving capability of the MOSTr are obtained.

[0006] On the other hand, as a gate electrode material, polycrystalline silicon doped with an n-type impurity (n⁺poly-Si) has been frequently used in the past. However, in order to set a threshold voltage (Vth) of an n-channel MOS transistor (NMOSTr) to near 0.5 to 1.0V of a usual enhancement type MOS transistor by using n⁺poly-Si for the gate electrode material, it is necessary to control the impurity concentration of the channel region to about 10 ¹⁷/cm³ or more.

[0007] Further, in order to prepare a full depletion type enhancement type MOSTr, the method has been studied of using a polycrystalline silicon doped with boron as a p-type impurity (p⁺poly-Si) as the gate electrode material in place of the n⁺poly-Si for the gate electrodes of the NMOSTr.

[0008] In this method of using p⁺poly-Si for the gate electrodes of an NMOSTr, if the impurity is not included in the channel region (non-doped), Vth becomes substantially 1.0V. Further, where it is intended to make Vth a further lower value, it has been necessary to perform counter-doping to dope an n-type impurity, for example, phosphorus (P⁺), in the channel region of the NMOSTr. However, when performing the counter-doping, the short channel effect is increased, so this not preferred for a miniaturized LSI.

[0009] In this way, in any case of using n⁺poly-Si and p⁺poly-Si as the gate electrode material, in the preparation of a semiconductor device using an SOI substrate having a fine structure with a thin silicon active layer, it was extremely difficult to control the Vth of a full depletion type MOSTr to a suitable value of about 0.5V.

[0010] Further, even in the case of preparing a MOSTr with a channel region of a partial depletion type, careless increase of the impurity concentration of the channel region is not preferred in that it increases the drain leak current.

[0011] Further, semiconductor devices using bulk silicon substrates have been being miniatured as well. When using a bulk silicon substrate, it is not possible to form a surface channel type MOSTr resistant to a short channel effect simultaneously in both of the N-channel and the P-channel using only n⁺poly-Si for the gate electrodes. Therefore, as shown in FIGS. 1A to 1C, a so-called dual gate process of using n⁺poly-Si for the NMOSTrs (shown in FIG. 1A) and using p⁺poly-Si for the p-channel MOS transistors (PMOSTr) (shown in FIG. 1B) has been studied for the purpose of adjustment of the Vth by using the work function of the gate electrodes.

[0012] However, in this dual gate process as well, when using poly-Si gate electrodes 14 a and 14 b of different types of dopants between the NMOSTr (shown in FIG. 1A) and the PMOSTr (shown in FIG. 1B), as shown in FIG. 1C, there is a problem that impurities in the gate electrodes diffuse into from each other (indicated by arrows in the figure) in parts at which the n⁺poly-Si gates of the NMOSTr and the p⁺poly-Si gates of the PMOSTr are connected and that the work functions of the gate electrodes largely fluctuate.

[0013] This problem becomes particularly conspicuous when a silicide is further formed at an upper layer of the poly-Si to be made to tungsten polycide (W-polycide) in order to lower the resistance of the gate electrodes formed by the dual gate process, as shown in FIGS. 1A to 1C, since the diffusion coefficient of the dopant in the tungsten silicide (WSi_(x)) is extremely large.

[0014] Note that, in FIGS. 1A to 1C, 11 denotes a silicon substrate, 12 a field oxide film, 13 a gate insulating film, 14 a a gate electrode of a NMOS transistor, 14 b a gate electrode of a PMOS transistor, 14 c a junction portion of the gate electrodes of the NMOS transistor side and the PMOS transistor side, and 15 an inter-layer insulating film.

[0015] In this way, even in a case where a SOI substrate is used and even in a case where a bulk silicon substrate is used, in order to deal with the miniaturization of semiconductor devices in the future, there is a problem with usage of different types of poly-Si for the gate electrode material. In place of this, it has been considered necessary to use a gate electrode material having a work function near the mid-gap.

[0016] The energy band of the semiconductor has a structure where an electronically filled band (a filled band or a valence band) and an empty band (conduction band) are separated by a prohibit band, and in the present invention, a gate electrode material having a work function near the mid-gap means a conductive material which has a work function (energy difference between a vacuum level and a Fermi level) almost the same as that near the center (near mid-gap) of the width of this prohibit band (band gap).

[0017] Summarizing the problem to be solved by the invention, among the gate electrode materials having a work function near this mid-gap, refractory metal silicide or refractory metal does not directly react with the SiO₂ and does not cause conspicuous deterioration of the gate withstand voltage, so attracts attention as particularly preferred material and has been studied as gate electrode material.

[0018] However, as shown in FIG. 2, when a gate insulating film 23 is formed on a silicon substrate 21 and a gate electrode is further formed on this by a single layer film 24 made of WSi_(x) or another refractory metal suicide, there is the problem that a reduction of the gate insulation withstand voltage or a reduction of a gate capacity occurs in comparison with the case of the related art where a gate electrode such as poly-Si (or W-polycide) is used. Note that, in FIG. 2, 21 denotes a silicon substrate, 22 a field oxide film, 23 a gate insulating film, 24 a gate electrode made of a single WSi_(x) layer, and 25 an inter-layer insulating film.

[0019] The reduction of the gate insulation withstand voltage is not preferred for a next generation device which is further miniaturized and where the gate oxide film is made further thinner. Further, the reduction of the gate capacity invites a reduction of the drive capability of the transistors etc. and as a result ends up lowering the operating speed of the device.

SUMMARY OF THE INVENTION

[0020] An object of the present invention is to provide a semiconductor device having a conductive layer, preferably a gate electrode, using a conductive material having a work function near the mid-gap of the energy band gap of the substrate material, preferably silicon, at least in the vicinity of the boundary with an insulating film, preferably gate oxide film, formed on the substrate, not causing deterioration of the insulation withstand voltage of the insulating film formed on the substrate, not causing a reduction of the capacity (gate capacity) of the conductive layer after formation, and maintaining the operating speed of the device and a method for producing the semiconductor device.

[0021] The present inventor discovered the fact that the reduction of the gate insulation withstand voltage and the reduction of the gate capacity in the case of forming the gate electrodes by a single layer film made of WSi_(X) or another refractory metal silicide were due to the heat treatment step performed after the gate electrodes were formed and to the As and other impurities being taken into the WSi_(x) or other refractory metal silicide and resulting growth of the grain of the WSi_(x) or other refractory metal silicide.

[0022] Accordingly, if the growth of the grain of the WSi_(x) or other refractory metal silicide can be suppressed by a certain method, it can be expected that a gate electrode can be obtained in which the short channel effect is suppressed and the operating speed of the device is maintained without adding any change to conditions of the heat treatment step or step for doping the impurity and without inviting a reduction of the gate insulation withstand voltage or a reduction of the gate capacity.

[0023] The present inventor engaged in intensive studies and as a result discovered that by using refractory metal silicide, refractory metal or other conductive materials having a work function near the mid-gap of the energy band gap of the substrate material (silicon) and causing doping of a certain type of impurity into the conductive material, it is possible to suppress the grain growth of the conductive material and thereby completed the present invention.

[0024] Namely, the present invention provides a semiconductor device comprising a substrate, an insulating film formed in the substrate, a conductive layer formed on the insulating film and having at least a part in contact with the insulating film made of a conductive material having a work function near a substantial center of an energy band gap of the substrate material, and a takeout electrode formed in the substrate, characterized in that the conductive material contains a predetermined amount of impurity.

[0025] In the semiconductor device of the first aspect of the invention, the impurity is preferably an impurity suppressing the grain growth of the conductive material. As the impurity, more concretely, oxygen, nitrogen, boron, etc. is more preferably used.

[0026] Alternatively, the conductive layer preferably has a conductive material containing impurity having different concentrations in a depth direction (perpendicular direction with respect to the substrate) and having a work function near the substantial center of the energy band gap of the substrate material, for example, a refractory metal silicide layer or a refractory metal layer, more preferably has a conductive material with a center region with respect to a depth direction thereof containing an impurity having a higher concentration than those of upper and lower regions thereof having the work function near the substantial center of the energy band gap of a substrate material, for example, a refractory metal silicide layer or a refractory metal layer.

[0027] Alternatively, more preferably, the conductive layer contains two or more types of impurities. Preferably, at least one of the two or more types of impurities is oxygen, nitrogen, or boron. Each of the two or more types of impurities further preferably are contained in a concentration of 1×10¹⁹/cm³ to 1×10²¹/cm³.

[0028] Further, the substrate material is preferably silicon, and the conductive material is preferably a refractory metal silicide or a refractory metal.

[0029] As the refractory metal silicide, one, two or more types selected from a group consisting of tungsten silicide (WSi_(x)), molybdenum silicide (MoSi_(x)), tantalum silicide (TaSi_(x)), and titanium silicide (TiSi_(x)) can be exemplified.

[0030] As the refractory metal, one, two or more types selected from a-group consisting of tungsten (W), tantalum (Ta), and titanium (Ti) can be exemplified.

[0031] Further, as the takeout electrode, for example, a source and a drain formed on the substrate can be mentioned.

[0032] The present invention provides, second, a semiconductor device comprising a silicon substrate, a gate insulating film formed in the silicon substrate, a gate electrode formed on the gate insulating film and having at least a part in contact with the gate insulating film made of a refractory metal silicide layer containing an impurity or a refractory metal layer containing an impurity, and a takeout electrode formed in the silicon substrate. The second aspect of the invention more concretely specifies the semiconductor device of the first aspect of the invention.

[0033] In the second aspect of the invention, as the silicon substrate, an n-type silicon semiconductor substrate, a p-type silicon semiconductor substrate, an by SOI substrate, etc. can be used.

[0034] The present invention provides, third, a method for producing a semiconductor device comprising steps of forming an insulating film in a substrate, forming a conductive layer made of a conductive material having a work function near a substantive center of an energy band gap of the substrate material on the insulating film, doping an impurity into the conductive layer, and forming a takeout electrode in the substrate.

[0035] In the third aspect of the invention, the step of doping the impurity into the conductive layer preferably has a step of doping the impurity into the conductive layer by an ion implantation process, a step of doping a impurity suppressing a grain growth of the conductive layer into the conductive layer by the ion implantation process and/or a step of forming the conductive film containing the impurity on the insulating film by a chemical vapor deposition process (CVD process).

[0036] Further, the step of doping the impurity into the conductive layer preferably has a step of doping the impurity so that an impurity concentration varies in a depth direction and more preferably has a step of doping the impurity into the conductive layer so that a concentration of the impurity contained in a center region thereof with respect to a depth direction thereof becomes higher than impurity concentrations of upper and lower regions thereof.

[0037] More concretely, the step of doping the impurity into the conductive layer preferably has a step of doping oxygen, nitrogen, or boron into the conductive layer.

[0038] Further, the step for doping the impurity into the conductive layer preferably has a step of doping two or more types of impurities into the conductive layer and, in this case, more preferably, has a step of doping at least oxygen, nitrogen, or boron into the conductive layer and further preferably has a step of doping each of the two or more types of impurities into the conductive layer with the concentration of 1×10¹⁹/cm³ to 1×10²¹/cm³.

[0039] In the third aspect of the invention, as the substrate, preferably a silicon substrate such as a p-type silicon semiconductor substrate, n-type silicon semiconductor substrate, or SOI substrate is used.

[0040] The step of forming the conductive layer made of the conductive material having the work function near the substantive center of the energy band gap of the substrate material preferably has a step of forming a refractory metal silicide layer or a refractory metal layer on the substrate.

[0041] The step of forming the refractory metal silicide layer preferably has a step of forming a layer made of one, two or more types selected from a group consisting of tungsten silicide (WSi_(x)), molybdenum silicide (MoSi_(x)), tantalum silicide (TaSi_(x)), and titanium silicide (TiSi_(x)).

[0042] Further, the step of forming the refractory metal layer preferably has a step of forming a layer made of one, two or more types selected from a group consisting of tungsten (W), tantalum (Ta), and titanium (Ti).

[0043] Further, the present invention provides, fourth, a method for producing a semiconductor device comprising steps of forming a gate insulating film in a silicon substrate, forming a conductive layer made of a conductive material having a work function of a substantial center of an energy band gap of the silicon on the gate insulating film, doping an impurity into the conductive layer, forming a gate electrode by processing the conductive layer, and forming a takeout electrode in the silicon substrate. The fourth aspect of the invention more concretely specifies the invention of the method of production of the third aspect of the invention and is the method for producing a semiconductor device according to the second aspect of the invention.

[0044] In the fourth aspect of the invention, as the silicon substrate, a p-type silicon semiconductor substrate, n-type silicon semiconductor substrate, SOI substrate, etc. can be preferably used.

[0045] The semiconductor devices of the first and second aspects of the invention are characterized in that at least a part of a conductive layer, preferably gate electrode, in contact with the insulating film, preferably gate insulating film, is made of a conductive material having a work function near the substantive center of the energy band gap of the substrate material, preferably refractory metal silicide or refractory metal, and the conductive material contains an impurity.

[0046] Accordingly, the semiconductor devices of the first and second aspects of the invention are semiconductor devices having conductive layers (gate electrodes) in which a so-called short channel effect is suppressed and the operating speed of the device is maintained. In addition, they are semiconductor devices in which the dielectric breakdown of the insulating film of the lower layer accompanied with grain growth of the refractory metal silicide or the refractory metal or other conductive material or in a MOSTr the insulating film (gate insulating film) dielectric breakdown and the reduction of the gate capacity, which had become a problem of the related art, are suppressed.

[0047] Further, when the conductive material of the conductive layer of the semiconductor device of the present invention contains two or more types of impurities, in comparison with a case where one type of impurity is doped, it is possible to more effectively suppress the grain growth of the conductive layer. Accordingly, even in a case where a thinner insulating film, for example a gate insulating film having a thickness of about 4 nm, is formed, the semiconductor devices having a conductive layer, that is, gate electrodes, excellent in a reliability without causing deterioration of the insulation withstand voltage are provided.

[0048] Further, according to the method of production of the semiconductor devices of the third and fourth aspects of the invention, a semiconductor device can be produced having a conductive layer, that is, gate electrodes, in which the short channel effect is suppressed and the operating speed of the device is maintained without adding any change to the conditions of the heat treatment step and the step of doping the impurity after this and without causing a reduction of the insulation withstand voltage and the reduction of the gate capacity.

[0049] Further, by doping the impurity nonuniformly in the depth direction of the conductive layer, preferably so that the center portion with respect to the depth direction of the conductive layer has a relatively high concentration and the upper and lower regions thereof have a relatively low concentration, a MOSTr having insulating film boundary surface characteristics similar to those of the case where the impurity is not doped can be formed. Accordingly, according to the methods of production of a semiconductor device of the present invention, the degree of freedom of process design of the semiconductor device is not lowered.

[0050] Further, when there is the step of doping the impurity into the conductive layer by the ion implantation process, the impurity can be ion implanted with a correctly controlled acceleration energy and dosage.

[0051] Accordingly, according to the present invention, the degree of integration of the LSI can be improved, the drive capability of the MOSTr can be improved according to the design rule, and high speed operation of the device becomes possible.

BRIEF DESCRIPTION OF THE DRAWINGS

[0052] These and other objects and features of the present invention will become clearer from the following description of the preferred embodiments given with reference to the accompanying drawings, in which:

[0053]FIGS. 1A to 1C are conceptual views for explaining the problem of the dual gate process in the related art;

[0054]FIG. 2 is a conceptual view for explaining the problem where a gate electrode made of a single layer of a refractory metal silicide of the related art is formed;

[0055]FIGS. 3A to 3B are sectional views of the structure of a region in which a MOS transistor of a semiconductor device of the present invention is formed;

[0056]FIGS. 4A to 4B are sectional views of the structure of a region in which a MOS transistor of a semiconductor device of the present invention is formed;

[0057]FIGS. 5A to 5D are sectional views of principal steps of a method for producing a semiconductor device of the present invention;

[0058]FIGS. 6A to 6D are sectional views of principal steps of a method for producing a semiconductor device of the present invention;

[0059]FIGS. 7A to 7D are sectional views of principal steps of a method for producing a semiconductor device of the present invention;

[0060]FIGS. 8A to 8D are sectional views of principal steps of a method for producing a semiconductor device of the present invention;

[0061]FIGS. 9A to 9C are sectional views of principal steps of a method for producing a semiconductor device of the present invention;

[0062]FIGS. 10A to 10C are sectional views of principal steps of a method for producing a semiconductor device of the present invention;

[0063]FIGS. 11A to 11C are sectional views of principal steps of a method for producing a semiconductor device of the present invention;

[0064]FIG. 12 is a view of results of an evaluation test results of the gate withstand voltage characteristics (TZDB: Time Zero Dielectric Breakdown) in a case where a gate insulating film is formed on a silicon substrate and a gate electrode made of a WSi_(x) film containing various concentrations of nitrogen is further formed thereon, in which an ordinate represents a cumulative failure rate, and an abscissa represents a gate withstand voltage; and

[0065]FIG. 13 is a view of results of an evaluation test of the gate withstand voltage characteristics (TZDB) in a case where a gate insulating film is formed on a silicon substrate and a gate electrode made of a WSi_(x) film containing a predetermined concentration of nitrogen and various concentrations of boron is further formed thereon, in which an ordinate represents the cumulative failure rate, and an abscissa represents the gate withstand voltage.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0066] Below, embodiments of the present invention will be explained by referring to the drawings.

[0067] First Embodiment

[0068] The first embodiment is a semiconductor device having a p-channel MOS transistor as shown in FIG. 3A.

[0069] The semiconductor device shown in FIG. 3A has a gate oxide film 103 made of silicon oxide on a region of an n-type silicon semiconductor substrate 101 sectioned by a field oxide film 102 and further has a gate electrode having a single layer structure made of a WSi_(x) (tungsten silicide) film 104 having a thickness of about 100 nm on this gate oxide film 103.

[0070] Further, an impurity diffusion region (source and drain region) doped with the p-type impurity is formed in a peripheral area below a gate electrode of the n-type silicon semiconductor substrate 101 and electrically connected to an interconnection layer 108 via connection plugs 107. The upper portion of the gate electrode has a structure covered by an inter-layer insulating film 106.

[0071] The WSi_(x) film 104 of the gate electrode of this semiconductor device contains oxygen in a dosage of 5×10¹⁴/cm² (about 5×10¹⁹/cm³ in concentration). As a result, the grain size of the WSi_(x) film 104 is suppressed to a size of about 20 nm at the maximum even after heat treatment at for example 850° C. for 30 minutes.

[0072] Accordingly, the semiconductor device of the present embodiment is a semiconductor device having a MOS transistor with a high reliability in which the short channel effect is suppressed without causing a reduction of the insulation withstand voltage and the reduction of the gate capacity and by which the operating speed of the device is maintained.

[0073] Second Embodiment

[0074] The second embodiment is a semiconductor device having an n-channel MOS transistor as shown in FIG. 3B. The semiconductor device shown in FIG. 3B has substantially the same structure as that of the semiconductor device shown in the first embodiment. The gate electrode is formed by a single WSi_(x) film layer 204 containing oxygen as an impurity.

[0075] In this semiconductor device, the oxygen concentration in the WSi_(x) film 204 is changed with respect to the depth direction. Namely, the WSi_(x) film 204 has a structure where the oxygen concentration is sufficiently low (about 10¹⁷/cm³ or less) in the boundary surface region with a gate oxide film 203 (WSi_(x) film 204 a: region with a thickness of about 10 nm from the gate oxide film 203 side), then the oxygen concentration becomes for example about 5×10¹⁹/cm³ in the center region (WSi_(x) film 204 b: region with a thickness of about 30 nm from 204 a side), and further the oxygen concentration becomes about 1×10¹⁷cm³ or less in the region above the former (WSi_(x) film 204 c: region with a thickness of about 60 nm from 204 b side).

[0076] By forming the gate electrode of the semiconductor device of the present embodiment by such a structure, it becomes possible to suppress the grain growth of the WSi_(x) film 204 a in the vicinity in contact with at least the gate oxide film 203 of the WSi_(x) film 204 while holding the boundary surface characteristic between the WSi_(x) film 204 and the underlying gate oxide film 203.

[0077] Namely, in the center region (WSi_(x) film 204 b) in which the oxygen concentration is relatively high, i.e., about 5×10¹⁹/cm³, the grain growth of the WSi_(x) is obstructed due to the influence of this oxygen. Also, in the WSi_(x) film 204 a of the part (lower region) in contact with the gate oxide film having a relatively low oxygen concentration, the grain growth is suppressed due to the restriction of the grain growth in the depth direction thereof.

[0078] Further, the region with the thickness of 60 nm of the WSi_(x) film 204 c located in the uppermost layer (upper region) of the gate electrode, the impurity concentration of the oxygen is also relatively low (it is not necessary to raise the oxygen concentration) and the thickness is relatively large, so the grains are relatively large and grow to the size of about 50 nm, but the growth of the WSi_(x) film 204 c does not assist the deterioration of the gate-insulation withstand voltage and the reduction of the gate capacity and contribute to only the reduction of the resistance of the gate electrode.

[0079] Accordingly, the semiconductor device of the present embodiment is a semiconductor device having a MOS transistor with an extremely high reliability in which the short channel effect is suppressed, the operating speed of the device is maintained, and gate insulating film dielectric breakdown and the reduction of the gate capacity are further suppressed.

[0080] Third Embodiment

[0081] The third embodiment is a semiconductor device having a similar structure to that of the semiconductor device of the first embodiment (illustration is omitted for convenience). The gate electrode of this semiconductor device is made of a single layer of a WSi_(x) film doped with nitrogen in a dosage of 5×10¹⁵/cm² (5×10²⁰/cm³ in terms of concentration) in place of oxygen.

[0082] In this case as well, the grain size of the WSi_(x) film is a size within about 20 nm even after heat treatment at for example 850° C. for 30 minutes.

[0083] Accordingly, the semiconductor device of the present embodiment is a semiconductor device having a MOS transistor with an extremely high reliability in which the short channel effect is suppressed, the operating speed of the device is maintained, and gate insulating film dielectric breakdown and the reduction of the gate capacity are further suppressed.

[0084] Fourth Embodiment

[0085] The fourth embodiment is a semiconductor device having an n-channel MOS transistor as shown in FIG. 4A.

[0086] The semiconductor device shown in FIG. 4A has a gate oxide film 303 made of silicon oxide on a region of a p-type silicon semiconductor substrate 301 sectioned by a field oxide film 302 and further has a gate electrode having a single layer structure of a WSi_(x) (tungsten silicide) film 304 having a thickness of about 100 nm on this gate oxide film 303.

[0087] This semiconductor device has a lightly doped drain (LDD) structure in which a side wall protection film 306 is formed on a side wall portion of the gate electrode, an n⁺ impurity diffusion region (source and drain region) 307 doped with an n-type impurity is formed in a peripheral area below the side wall protection film 306 of the p-type silicon semiconductor substrate 301, and further an ⁻ impurity diffusion region 305 is formed in the channel region adjoining the n⁺ impurity diffusion region. For this reason, the influence upon the source end is suppressed by having the drain field absorbed into the ⁻ impurity diffusion region 305 and the field intensity is reduced.

[0088] Further, the n⁺ impurity diffusion region 307 is electrically connected to an interconnection layer 310 via connection plugs 309. The upper portion of the gate electrode has a structure covered by an inter-layer insulating film 308.

[0089] In the WSi_(x) film 304 of the gate electrode of this semiconductor device, nitrogen in a dosage of 5×10¹⁵/cm² (about 5×10²⁰/cm³ in concentration) and boron in a dosage of 5×10¹⁵/cm² (about 5×10²⁰/cm³ in concentration) are simultaneously doped.

[0090] As a result, the grain size of the WSi_(x) film 304 becomes a size within about 15 nm even after heat treatment at for example 850° C. for 30 minutes. The grain growth of the WSi_(x) film is further suppressed from that of the case where only nitrogen is doped.

[0091] Accordingly, the semiconductor device of the present embodiment is a semiconductor device having a MOS transistor with an extremely high reliability in which gate insulating film dielectric breakdown and the reduction of the gate capacity are further suppressed.

[0092] Fifth Embodiment

[0093] The fifth embodiment is a semiconductor device having an n-channel MOS transistor having a similar structure to that of the semiconductor device of the second embodiment (the illustration is omitted for convenience).

[0094] The gate electrode of this semiconductor device has a gate electrode made of a single layer structure of a WSi_(x) film having a thickness of about 100 nm containing nitrogen and boron as impurities. The WSi_(x) film uniformly contains the boron in a concentration of about 1×10¹⁹/cm³ and contains the nitrogen in varied concentrations thereof with respect to the depth direction.

[0095] Namely, this WSi_(x) film has a structure in which the nitrogen concentration is sufficiently low (about 10¹⁹/cm³ or less) in the surface boundary region with the gate oxide film (first region with a thickness of about 10 nm from the gate oxide film side), then the nitrogen is contained with a concentration of for example about 1×10²¹/cm³ in the center region (second region with a thickness of about 30 nm from the first region side), and further the oxygen is contained so that the concentration becomes about 1×10¹⁹/cm³ or less in the region above this (third region with a thickness of about 60 nm from the second region side).

[0096] By forming the gate electrode of the semiconductor device of the present embodiment with such a structure, it becomes possible to suppress the grain growth of the WSi_(x) film of the first region in the vicinity in contact with the gate oxide film while holding an excellent surface boundary characteristic between the WSi_(x) film and the gate oxide film of the underlying layer.

[0097] Namely, in the center region (second region) in which the nitrogen concentration is relatively high, i.e., 1×10²¹/cm³, the grain growth of the WSi_(x) is obstructed due to the influence of the nitrogen and boron. Also, in the WSi_(x) film of the part (first region) in contact with the gate oxide film in which the nitrogen concentration is relatively low, the grain growth is suppressed due to the restriction of the grain growth in its thickness direction.

[0098] Further, in the region with a thickness of 60 nm of the WSi_(x) film located in the uppermost layer (third region) of the gate electrode, the impurity concentration of the nitrogen is also relatively low (it is not necessary to raise the nitrogen concentration) and the film substrate is relatively thick, therefore the go grains grow relatively large (about 30 nm), but the growth of the WSi_(x) film in this third region does not assist the deterioration of the gate insulation withstand voltage and the reduction of the gate capacity and only contributes to the reduction of the resistance of the gate electrode.

[0099] Accordingly, the semiconductor device of the present embodiment is one having a MOS transistor with an extremely high reliability in which the gate insulating film dielectric breakdown and the reduction of the gate capacity are further suppressed.

[0100] In the first to fifth embodiments explained above, the present invention was explained by taking as an example a semiconductor device having a gate electrode made of a single WSi_(x) film. The semiconductor device of the present invention is not limited to this, however. The gate electrode thereof may be formed by another refractory metal silicide, for example, molybdenum silicide (MoSi_(x)), tantalum silicide (TaSi_(x)), or titanium silicide (TiSi_(x)), a refractory metal, for example, tungsten (W), tantalum (Ta), or titanium (Ti), or another conductive material.

[0101] Sixth Embodiment

[0102] Further, it is possible even if the gate electrode is formed by a laminate of a refractory metal silicide or refractory metal and conductive polycrystalline silicon layer doped with a p-type impurity or n-type impurity. The sixth embodiment is a semiconductor device having such a gate electrode.

[0103] The semiconductor device shown in FIG. 4B has a gate oxide film 403 made of silicon oxide on a region of an n-type silicon semiconductor substrate 401 sectioned by a field oxide film 402 and further has a gate electrode having a dual layer structure comprising a WSi_(x) film 404 a having a thickness of about 60 nm on this gate oxide film 403 and a conductive polycrystalline silicon layer 404 b on the WSi_(x) film 404 a.

[0104] Further, in the peripheral region below the gate electrodes of the n-type silicon semiconductor substrate 401, an impurity diffusion region (source and drain region) 405 doped with the p-type impurity is formed and electrically connected to an interconnection layer 408 via connection plugs 407. The upper portion of the gate electrode has a structure covered by an inter-layer insulating film 406.

[0105] The WSi_(x) film 404 a of the gate electrode of this semiconductor device is formed in contact with the top of the gate insulating film 403 and contains oxygen in a dosage of 5×10¹⁴/cm² (about 5×10¹⁹/cm³ in concentration). As a result, the grain size of the WSi_(x) film 404 a is suppressed to a size of about 20 nm at the maximum even after heat treatment at for example 850° C. for 30 minutes.

[0106] Accordingly, in the semiconductor device of the present embodiment as well, a semiconductor device having a MOS transistor with a high reliability in which the short channel effect is suppressed and the operating speed of the device is maintained without inviting a reduction of the insulation withstand voltage and a reduction of the gate capacity is obtained.

[0107] In the sixth embodiment, an explanation was made by taking as an example a semiconductor device having a gate electrode of a laminate structure of a WSi_(x) film and conductive polycrystalline silicon, but it may also be formed by a laminate of a refractory metal silicide or refractory metal other than WSi_(x) and the conductive polycrystalline silicon. Note that the boundary part with at least the gate insulating film must be formed by a conductive material having a work function of the substantive center of the mid-gap of the substrate material.

[0108] Further, in the first to sixth embodiments, the explanation was made by taking as an example a semiconductor device in which the conductive layer was the gate electrode formed on the gate insulating film, but it may also be a semiconductor device in which the conductive layer is a MOS capacitor of a similar structure other than this or a semiconductor device in which a conductive layer doped with an impurity is used for the electrodes of the MOSTr MOS capacitor formed on a p-well or an n-well provided on the silicon semiconductor substrate.

[0109] Further, in the first to sixth embodiments, a bulk silicon substrate (n-type silicon semiconductor substrate) was used as the substrate, but it may also be a bulk silicon substrate (p-type silicon semiconductor substrate) or substrate of an SOI structure.

[0110] Next, the method for producing the semiconductor device will be explained in detail.

[0111] Note that the thickness of the conductive layer (WSi_(x) film), the dosage of impurity suppressing the grain growth, implantation conditions, conditions of heat treatment, etc. in the following embodiments are only examples thereof and that the design can be appropriately changed according to the semiconductor device to be formed.

[0112] Seventh Embodiment

[0113] The seventh embodiment is a method for producing a semiconductor device of the first embodiment. FIG. 5A to FIG. 5D and FIG. 6A to FIG. 6D show the steps of production of the MOSTr produced according to the present embodiment.

[0114] First, an explanation will be made of the steps up to FIG. 5A. On the p-type silicon semiconductor substrate 101, the field oxide film 102 is formed to a thickness of about 400 nm by the local-oxidation-of-silicon (LOCOS) process for wet oxidation at for example 950° C.

[0115] Next, the ions for the threshold voltage (Vth) are implanted in a surface layer portion of the active region serving as the source and drain region and the channel region, and the ions for forming a buried layer for preventing punch through are implanted in a deep portion of the silicon semiconductor substrate 101 (illustration omitted).

[0116] Then, pyrogenic oxidation is carried out at a temperature condition of 850° C. by using a gas mixture of H₂ and O₂. The gate oxide film 103 is formed on the region of the silicon substrate 101 sectioned by the field oxide film 102 with a thickness of for example 5 nm. A structure shown in FIG. 5A is obtained as described above.

[0117] Thereafter, as shown in FIG. 5B, the WSi_(x) film 104 of the gate electrode is stacked to about 100 nm. The WSi_(x) (film) 104 is formed by a low pressure chemical vapor deposition (LP-CVD) process under the following silicon-rich (WSi_(x): x=3.0) conditions in an SiH₂Cl₂+WF₆ reaction system so as not to conspicuously cause deterioration of the bonding and gate withstand voltage even if directly stacked on the gate oxide film 103.

[0118] Conditions for Forming WSi_(x) film 104

[0119] Film forming device: Cold-Wall type LP-CVD device

[0120] Film forming temperature: 600° C.

[0121] Film forming pressure: 40 Pa

[0122] Film forming gas (flow rate): SiH₂Cl₂/WF₆/Ar=160/1.6/100 sccm

[0123] Note that, as the tungsten silicide represented by WSi_(x) (x represents any number of 1 to 3), for example, W₂Si₃, WSi₂, WSi₃, etc. have been known.

[0124] Then, as shown in FIG. 5C, oxygen ions (O₂ ⁺ ions) are implanted into the entire surface under the conditions of an acceleration energy of 15 keV and a dosage of 5×10¹⁴/cm² in order to suppress the grain growth of the WSi_(x) film 104. The ions are implanted at this time so that the range of flight of the O₂ ⁺ ions is in the WSi_(x) film 104.

[0125] Further, as shown in FIG. 5D, a photoresist 109 is coated on the entire surface, patterning is carried out, and a resist pattern of the gate electrodes copying the gate electrode pattern is formed.

[0126] Next, as shown in FIG. 6A, the WSi_(x) film 104 is etched with this pattern formed resist 109 as a mask to form the gate electrodes.

[0127] The etching conditions at this time are for example as follows:

[0128] Etching device: ECR (electron cyclotron resonance) plasma etching device

[0129] Etching temperature: 20° C.

[0130] Pressure: 0.4 Pa

[0131] RF power: Step 1=80W, Step 2=30W

[0132] Gas flow rate: Cl₂/O₂=75/5 sccm

[0133] Then, as shown in FIG. 6B, for example the p-type impurity BF₂ ⁺ is implanted with an acceleration energy of about 20 keV and a dosage of about 3×10¹⁵/cm² into the region of the n-type silicon semiconductor substrate 101 sectioned by the field oxide film 102 at the peripheral area below the gate electrodes using the resist mask 110 and the gate electrode 104 as a mask. Thereafter, heat treatment is carried out for 30 minutes at 850° C. in an N₂ atmosphere, then the impurity is activated so as to form a p-type impurity diffusion region (source and drain region) 105.

[0134] Thereafter, as shown in FIG. 6C, the resist mask 110 ,is removed and, as shown in FIG. 6D, the low pressure CVD process using for example O₂-TEOS (tetraethylorthosilicate) is used to stack the inter-layer insulating film 106 over the entire surface.

[0135] Further, contact holes reaching the p-type impurity diffusion region 105 are opened in the inter-layer insulating film 106 and a metal such as tungsten or aluminum is buried in the contact holes to form the contact plugs 110. The interconnection layer 111 made of aluminum or the like is then sequentially formed to produce a semiconductor device having the p-channel MOS transistor as shown in FIG. 3A.

[0136] According to the present embodiment, the WSi_(x) film 104 of the gate electrode doped with oxygen in a dosage of 5×10¹⁴/cm² (about 5×10¹⁹/cm³ in concentration) can be formed conveniently and with a good yield. Further, the grain size of this WSi_(x) film 104 can be suppressed to a size of about 20 nm at the maximum even after heat treatment (annealing after ion implantation) at for example 850° C. for 30 minutes. Accordingly, a semiconductor device having a MOS transistor with a high reliability in which the gate insulation layer dielectric breakdown and the reduction of the gate capacity are suppressed can be produced.

[0137] Eighth Embodiment

[0138] The present embodiment is an example of producing the semiconductor device of the second embodiment. In the seventh embodiment, the oxygen ions are uniformly. implanted into the WSi_(x) film on the gate oxide film, but in the present embodiment, the concentration of the oxygen ions contained in the WSi_(x) film constituting the gate electrode is varied in the depth direction.

[0139] First, as shown in FIG. 7A, similar to the first embodiment, a field oxide film 202 is formed to a thickness of about 400 nm on the p-type silicon semiconductor substrate 201 by the LOCOS process for wet oxidation at for example 950° C.

[0140] Then, ions for the threshold voltage (Vth) adjustment are implanted in the surface layer portion of the active region forming the source and drain region and the channel region, and ions for forming the buried layer for preventing punchthrough are implanted at the deep portion of the silicon semiconductor substrate 201 (illustration omitted).

[0141] Then, the pyrogenic oxidation is carried out at the temperature condition of 850° C. by using the gas mixture of H2 and O2, and the gate oxide film 203 is formed on the region sectioned by the field oxide film 202 of the silicon substrate 201 with a thickness of for example 5 nm. A structure shown in FIG. 7A is obtained as described above.

[0142] Then, as shown in FIG. 7B, the CVD process using SiH₂Cl₂—WF₆ is used to form a WSi_(x) film 204′ stacked on the gate oxide film 203 to a thickness of 100 nm. Thereafter, the oxygen ions are implanted in the WSi_(x) film 204′ so that the concentration of oxygen ions varies in the thickness direction (depth direction).

[0143] The ion implantation process can accurately control the energy and dosage of the ion implantation when the impurity is implanted and can determine the position of ions to be implanted by adjusting the energy (that is, it is determined to how deep a position from the surface on the ion implantation side the impurity ions are implanted). Further, by adjusting the dosage of the ion implantation, the concentration of the impurity to be doped can be adjusted.

[0144] In the present embodiment, the oxygen ions are implanted under for example the following conditions:

[0145] First, the oxygen ions are implanted within the range of about 10 nm in an upward direction from the gate oxide film boundary surface of the part in contact with the gate oxide film of the WSi_(x) film 204′ so that the oxygen concentration becomes 1×10¹⁷/cm³ or less (formation of the WSi_(x) film 204 a).

[0146] Then, the oxygen ions are implanted in the WSi_(x) film having a thickness of about 30 nm in the center region located within the range of 10 to 40 nm in the upward direction from the gate-oxide film boundary surface of the WSi_(x) film 204′ so that the oxygen concentration becomes about 5×10¹⁹/cm³ (formation of the WSi_(x) film 204 b).

[0147] Finally, the ions are implanted in the WSi_(x) film 204′ within the range of about 60 nm on this so that the oxygen concentration becomes about 1×10¹⁷/cm³ or less formation of the WSi_(x) film 204 c).

[0148] As described above, as shown in FIG. 7C, an WSi_(x) film 204 is obtained containing oxygen so that the oxygen concentration varies in the thickness direction (depth direction).

[0149] Next, similar to the seventh embodiment, a not illustrated photoresist is coated on the entire surface and then patterned to form a resist pattern of gate electrodes copying the gate electrode pattern. Further, the WSi_(x) film 204 is etched with this pattern-formed resist 109 as a mask to form the gate electrodes. A structure shown in FIG. 7D is obtained in the above way.

[0150] Thereafter, a similar process as that of the seventh embodiment is followed to produce the semiconductor device as shown in FIG. 3B.

[0151] According to the present embodiment, the grain growth of the WSi_(x) film 204 a in the vicinity in contact with at least the gate oxide film 203 of the WSi_(x) film 204 can be suppressed while holding the boundary surface characteristic between the WSi_(x) film 204 and the gate oxide film 203 of the underlying layer.

[0152] Namely, in the center region (WSi_(x) film 204 b) in which the oxygen concentration is relatively high, i.e., 5×10¹⁹/cm³, the grain growth of the WSi_(x) is obstructed due to the influence of the oxygen. Further, in the WSi_(x) film 204 a of the part (lower region) in contact with the gate oxide film in which the oxygen concentration is relatively low, the grain growth in the thickness direction is restricted, so the grain growth can be suppressed.

[0153] Further, in the region with the thickness of 60 nm of the WSi_(x) film 204 c located in the uppermost layer (upper region) of the gate electrode, the impurity concentration of oxygen is relatively low (it is not necessary to raise the oxygen concentration) and the thickness is relatively large, so the grains are also relatively large and grow to a size of about 50 nm, but the growth of the WSi_(x) film 204 c in this part does not assist the deterioration of the gate insulation withstand voltage and the reduction of the gate capacity and only contributes to the reduction of the resistance of the gate electrodes.

[0154] Accordingly, according to the present embodiment, a semiconductor device having a MOS transistor with an extremely high reliability in which the gate insulation dielectric breakdown and the reduction of the gate capacity are further suppressed can be produced.

[0155] Ninth Embodiment

[0156] The ninth embodiment is an example of production of the semiconductor device shown in the fourth embodiment. Below, the method of production of the semiconductor device of the present embodiment will be explained by referring to the drawings.

[0157] First, as shown in FIG. 8A, a field oxide film 302 is formed on an n-type silicon semiconductor substrate 301 to a thickness of about 400 nm by the LOCOS process for wet oxidation at for example 950° C.

[0158] Next, ions for the threshold voltage (Vth) adjustment are implanted at the surface layer portion of the active region forming the source and drain region and the channel region, and ions for forming the buried layer for preventing the punchthrough are implanted at the deep portion of the silicon semiconductor substrate 301 (illustration omitted).

[0159] Next, pyrogenic oxidation is carried out under temperature conditions of 850° C. by using a gas mixture of H₂ and O₂ to form a gate oxide film 303 on the region of the silicon substrate 301 sectioned by the field oxide film 3O₂ to a thickness of for example 4 nm.

[0160] Then, as shown in FIG. 8B, a WSi_(x) film 304′ is formed on the gate oxide film 303 to a thickness of about 100 nm. This WSi_(x) film 304′ must be formed under silicon-rich (WSi_(x): x=3.0) conditions in the reaction system of SiH₂Cl₂+WF₆ so as not to conspicuously cause the deterioration of the bonding and gate withstand voltage even if the WSi_(x) film 304′ is directly stacked on the gate oxide film 303.

[0161] Next, the impurity is doped into the WSi_(x) film. The doping of the impurity is effectively carried out before the application of the heat treatment at first after stacking the WSi_(x). Most preferably, it is doped in-situ when the WSi_(x) is stacked. In the present embodiment, the boron is uniformly doped in the thickness direction of the WSi_(x), and the nitrogen is doped after the formation of the WSi_(x) film. For example, under the following conditions, an Si_(x) film doped with the boron in-situ is formed:

[0162] Film forming device: Cold-Wall type LP-CVD device

[0163] Film forming temperature: 680° C.

[0164] Film forming pressure: 40 Pa

[0165] Film forming gas (flow rate): SiH₂Cl₂/WF₆/B₂H₆/Ar=160/1.6/0.5/100 sccm.

[0166] Then, as shown in FIG. 8C, nitrogen ions are implanted into the entire surface under conditions of for example an energy of 20 keV and a dosage of 5×10¹⁵/cm². At this time, the range of flight of the nitrogen ions must be in the WSi_(x) film.

[0167] Thereafter, as shown in FIG. 8D, a resist pattern 311 of the gate electrodes is formed, then, as shown in FIG. 9A, the resist pattern 311 is used as a mask to process the WSi_(x) film 304′ under the following etching conditions to form the gate electrodes 304.

[0168] Etching Conditions of WSi_(x)

[0169] Etching device: ECR Plasma Etcher

[0170] Etching temperature: 20° C.

[0171] Etching pressure: 0.4 Pa

[0172] Rf Power: Step 1=80W, Step 2=30W

[0173] Etching gas: Cl₂/O₂=75/5 sccm

[0174] Next, as shown in FIG. 9B, by doping the impurity into the peripheral area below the gate electrode of the region of the silicon substrate 301 sectioned by the field oxide film 302, the p-type impurity diffusion region 305 is formed. In the present embodiment, a PMOS transistor is formed, therefore, BF₂ ⁺ ions are implanted with an acceleration energy of about 20 keV and a dosage of 3×10¹⁵/cm².

[0175] In this case, when an NMOS transistor is formed, As ions can be implanted in place of BF₂ ⁺ ions. Further, for example, where an n-channel MOS transistor and p-channel MOS transistor are formed on the same silicon substrate like a CMOS transistor, it is necessary to use a resist mask to separately implant impurity ions of different conductivity types in the regions for forming the n-channel MOS transistor and the p-channel MOS transistor.

[0176] Next, as shown in FIG. 9C, silicon oxide film is stacked by the LP-CVD process using for example O₂-TEOS, then the side wall protection film 303 is formed by anisotropic etching.

[0177] Thereafter, the impurity is implanted in the peripheral area below the gate electrodes at the region of the silicon substrate 301 sectioned by the field oxide film 302 using the side wall protection film 303 as a mask. In the present embodiment, a PMOS transistor is formed, so as the condition of the ion implantation, for example, BF₂ ⁺ ions are implanted with an acceleration energy of 10 to 30 keV and a dosage of 3×10¹⁵/cm².

[0178] In this case, when an NMOS transistor is formed, As ions are implanted in place of BF₂ ⁺ ions. Further, for example, where an n-channel MOS transistor and p-channel MOS transistor are formed on the same silicon substrate like in a CMOS, it is necessary to use a resist mask to separately implant impurity ions of different conductivity types in the regions for forming the n-channel MOS transistor and the p-channel MOS transistor.

[0179] Further, the impurity is diffused, then the impurity is activated under the following conditions in an N₂ atmosphere to form the source and drain region 307.

[0180] Heat Treatment Conditions of Activation

[0181] Device: Electric furnace annealing device

[0182] Temperature: 850° C.

[0183] Time: 30 minutes

[0184] Then, by the usual process, an inter-layer insulating film 308 comprising three layers of a silicon oxide film, silicon nitride film, and boro-phosphosilicate glass (BPSG) (or non-doped silicate glass (NSG)) film is formed. For example, a silicon oxide film of a thickness of about 100 nm is stacked at a temperature of about 450° C. by a LP-CVD process using a gas mixture of SiH₄ and O₂, a silicon nitride film is formed on the silicon oxide film to a thickness of about 30 to 80 nm at a temperature of 760° C. by the LP-CVD process using a gas mixture of for example SiH₂Cl₂ and NH₃, and further a BPSG film or NSG film is formed on this silicon nitride film to a thickness of about 250 nm at a temperature of about 700° C. by the low pressure CVD process using a gas mixture of for example O₂ and TEOS, whereby an inter-layer insulating film 308 comprising three layers can be obtained.

[0185] Thereafter, a not illustrated resist pattern for forming the contact holes is formed on the inter-layer insulating film 308, then the BPSG (or NSG) film, silicon nitride film, and silicon oxide film are sequentially etched by anisotropic etching using the resist pattern as a mask, whereby not illustrated contact holes reaching the source and drain region 307 are opened. Then, these contact holes are buried with tungsten by for example the CVD process to form the connection plugs 309, then an interconnection layer 310 made of aluminum or the like is formed on this and other steps gone through to produce the semiconductor device as shown in FIG. 4A.

[0186] In the above way, a semiconductor device having a gate electrode made of WSi_(x) containing boron and nitrogen as impurities can be produced conveniently and with a good yield. The semiconductor device of the present embodiment is a semiconductor device having a MOS transistor with a high reliability in which gate insulating film dielectric breakdown and the reduction of the gate capacity are further suppressed since it has the gate electrodes formed of WSi_(x) containing boron and nitrogen as impurities.

[0187] Particularly, in the present embodiment, when stacking WSi_(x), the boron is doped in-situ, therefore it becomes possible to dope this so that the concentration becomes uniform in the depth direction in comparison with the case where this is doped by ion implantation.

[0188] 10th Embodiment

[0189] The 10th embodiment is an example of the method of production of the semiconductor device shown in the fifth embodiment. First, after going through similar processes to those of the ninth embodiment, as shown in FIG. 10A, a gate oxide film 503 is formed on a region of an n-type silicon semiconductor substrate 501 separated by a field oxide film 502.

[0190] Then, by combining the following conditions, a WSi_(x) film containing nitrogen and varying in concentration in the thickness direction (depth direction) is stacked on the gate insulating film.

[0191] As the first step, as shown in FIG. 10B, a WSi_(x) film 504 a is formed under the following conditions:

[0192] Film forming device: Cold-Wall type LP-CVD device

[0193] Film forming temperature: 680° C.

[0194] Film forming pressure: 40 Pa

[0195] Film forming gas (flow rate): SiH₂Cl₂/WF₆/B₂H₆/Ar=160/1.6/0.5/100 sccm

[0196] As the second step, as shown in FIG. 10C, a WSi_(x) film 504 b is formed under the following conditions:

[0197] Film forming device: Cold-Wall type LP-CVD device

[0198] Film forming temperature: 680° C.

[0199] Film forming pressure: 40 Pa

[0200] Film forming gas (flow rate): SiH₂Cl₂/WF₆/B₂H₆/Ar/NH₃=160/1.6/0.5/100/1.0 sccm

[0201] As the third STEP, as shown in FIG. 11A, a WSi_(x) film 504 c is formed under the following conditions:

[0202] Film forming device: Cold-Wall type LP-CVD device

[0203] Film forming temperature: 680° C.

[0204] Film forming pressure: 40 Pa

[0205] Film forming gas (flow rate): SiH₂Cl₂/WF₆/B₂H₆/Ar=160/1.6/0.5/100 sccm

[0206] Further, a not illustrated resist pattern for forming the gate electrodes is formed and the WSi_(x) films 504 a and 504 b and 504 c are etched similar to the ninth embodiment to form the gate electrodes as shown in FIG. 11B.

[0207] Thereafter, while the illustration of the steps is omitted, in the same way as in the ninth embodiment, a p-type impurity is diffused in the peripheral area below the gate electrodes of the silicon semiconductor substrate 501 by the ion implantation process, then activated by applying heat treatment (annealing), whereby the source and drain region 505 is formed. An inter-layer insulating film 506 is formed on the entire surface, then contact holes reaching the source and drain region 505 are formed in the inter-layer insulating film 506 and are buried by a conductive material such as tungsten to form the contact plugs 507. An interconnection layer 508 made of aluminum or the like is formed on this, whereby the semiconductor device as shown in FIG. 11C can be produced.

[0208] In the present embodiment, as the method of nonuniformly doping the impurity obstructing the grain growth of WSi_(x) in the depth direction of the WSi_(x) film 504, the CVD steps are changed (first step->second step->third step) and the impurity profile is controlled to mix in the impurity. By forming the WSi_(x) film while varying the nitrogen concentration in the depth direction in this way, the grain growth of WSi_(x) is obstructed in the center region (504 b) of the WSi_(x) film 504. By the restriction of the grain growth in the depth direction thereof, the grain growth in the WSi_(x) film 504 a can be suppressed near the boundary surface (504 a) with the thermal oxide film 503 of the lower region thereof while maintaining the bonding and work function in a state not influenced by the mixing of this impurity (while holding an excellent boundary surface characteristic). Further, in the upper layer part (upper region 504 c) of the WSi_(x) film 504, the grains of the WSi_(x) film grow large without being influenced by the impurity, but this influence is not exerted near the boundary surface (504 a) with the thermal oxide film 503, so a WSi_(x) film 504 c with a low resistance is obtained.

[0209] Accordingly, the semiconductor device of the present embodiment has a MOS transistor with a high reliability in which gate insulation dielectric breakdown and the reduction of the gate capacity are suppressed.

[0210] Note that, in the present embodiment, the concentration of the nitrogen contained in the WSi_(x) film is varied in the depth direction according to whether or not NH₃ is added to the gas composition in the CVD step, but it is also possible to form the WSi_(x) film so that the concentration of the nitrogen contained in the WSi_(x) film continuously varies in the thickness direction by continuously changing the flow rate of the NH₃.

[0211] 11th Embodiment

[0212] In the present embodiment, it is checked how the withstand voltage characteristic of the gate oxide film varies when changing the content of the nitrogen as the impurity in the WSi_(x) film when forming a gate oxide film on a silicon semiconductor substrate and further forming an WSi_(x) film on the gate oxide film.

[0213] Namely, a gate oxide film of a thickness of 4.0 nm was formed on a silicon semiconductor substrate, a WSi_(x) film with a thickness of 70 nm was formed on this, N₂ ⁺ ions were implanted with a predetermined dosage into the WSi_(x) film, then heat treatment was carried out at 850° C. for 30 minutes, then the gate electrodes were formed by the etching process and the withstand voltage characteristics of the gate oxide film were checked.

[0214] The results are shown in FIG. 12. In FIG. 12, the ordinate represents a cumulative failure (x 100%), and the abscissa represents the gate withstand voltage, that is, the “time zero dielectric breakdown voltage (TZDB (V))”. Further, the curve a indicates a case where the nitrogen ions were not implanted, b indicates a case where nitrogen ions were implanted with a dosage of 5×10¹⁵/cm², c indicates a case where nitrogen ions were implanted with a dosage of 7.5×10¹⁵/cm², and d indicates a case where nitrogen ions were implanted with a dosage of 1×10¹⁶/cm².

[0215] It is seen from FIG. 12 that excellent gate withstand voltage characteristics are obtained in all cases where nitrogen ions are implanted in comparison with the case where nitrogen ions are not implanted.

[0216] 12th Embodiment

[0217] In the 12th embodiment, it is checked how the withstand voltage characteristics of the gate oxide film vary when doping the nitrogen uniformly as the impurity in the WSi_(x) film and changing the content of the boron when forming a gate oxide film on a silicon semiconductor substrate and further forming an WSi_(x) film on the gate oxide film.

[0218] Namely, a gate oxide film of a thickness of 4.0 nm was formed on a silicon semiconductor substrate, an WSi_(x) film of a thickness of 70 nm was formed on this, N₂ ⁺ ions of a dosage of 5×10¹⁵/cm² were implanted into the entire surface of the WSi_(x) film, B⁺ ions were implanted in various dosages, heat treatment was carried out at 850° C. for 30 minutes, then gate electrodes was formed by etching process and the withstand voltage characteristics of the gate oxide film were checked.

[0219] The results are shown in FIG. 13. In FIG. 13, the ordinate represents the cumulative failure (x 100%), and the abscissa represents the time zero dielectric breakdown (TZDB (V)). Further, the curve a indicates a case where the B⁺ ions were not implanted, b indicates a case where B⁺ ions were implanted with a dosage of 1×10¹⁵/cm², c indicates a case where B⁺ ions were implanted with a dosage of 3×10¹⁵/cm², and d and e indicate cases where B⁺ ions were implanted with dosages of 5×10¹⁵/cm². d and e are results of experiments carried out by using two wafers under the same conditions.

[0220] As shown in FIG. 13, it was seen that almost the same results were obtained and there was reproducibility.

[0221] Further, it was seen from FIG. 13 that excellent time zero dielectric breakdown characteristics were obtained in all cases where the nitrogen ions and the B⁺ ions were implanted in comparison with the case where only the nitrogen ions were implanted.

[0222] Summarizing the effects of the invention, as explained above, the semiconductor devices of the first and second aspects of the invention are characterized in that a part of the conductive layer (preferably gate electrode) in contact with at least the insulating film (preferably gate insulating film) is made of a conductive material (preferably refractory metal silicide or refractory metal) having a work function near the substantive center of the energy band gap of the substrate material and in that the conductive material contains an impurity.

[0223] Accordingly, the semiconductor devices of the first and second aspects of the invention are semiconductor devices having conductive layers (gate electrodes) in which a so-called short channel effect is suppressed and the operating speed of the device is maintained. In addition, they are semiconductor devices in which the dielectric breakdown of the insulating film of the lower layer accompanied the grain growth of the refractory metal silicide, the refractory metal or other conductive material or in a MOSTr the dielectric breakdown of the insulating film (gate insulating film) and the reduction of the gate capacity, which have been problems of the related art, are suppressed.

[0224] Further, when the conductive material of the conductive layer of the semiconductor device of the present invention contains two or more types of impurities, it is possible to more effectively suppress the grain growth of the conductive material in comparison with the case where one type of impurity is doped. Accordingly, even in a case where a thinner insulating film (for example, gate insulating film having a thickness of about 4 nm) is formed, the result is a semiconductor device having a conductive layer (gate electrodes) with excellent reliability without causing the deterioration of the insulation withstand voltage.

[0225] Further, according to the methods of production of semiconductor devices of the third and fourth aspects of the invention, a semiconductor device can be produced having a conductive layer (gate electrodes) in which the short channel effect is suppressed and the operating speed of the device is maintained without adding any change to the conditions of the heat treatment step and the impurity doping step after this and without causing a reduction of the insulation withstand voltage and the reduction of the gate capacity.

[0226] Further, by doping the impurity nonuniformly in the depth direction of the conductive layer, preferably so that the concentration of the center portion with respect to the depth direction of the conductive layer becomes relatively high and the concentration of the upper and lower regions thereof becomes relatively low, a MOSTr having a similar insulating film boundary surface characteristic to that of the case where the impurity is not doped can be formed. Accordingly, according to the methods of production of the semiconductor devices of the present invention, the degree of freedom of the process design of the semiconductor device will not be lowered.

[0227] Further, where there is a step for doping the impurity into the conductive layer by the ion implantation process, the impurity can be implanted with the correctly controlled acceleration energy and dosage.

[0228] Accordingly, according to the present invention, the degree of integration of the LSI can be improved, the drive capability of the MOSTr can be improved according to the design rule, and high speed operation of the device becomes possible. 

What is claimed is:
 1. A semiconductor device comprising: a substrate, an insulating film formed in the substrate, a conductive layer formed on the insulating film and having at least a part in contact with the insulating film made of a conductive material having a work function near a substantial center of an energy band gap of the substrate material and containing a predetermined amount of impurity, and a takeout electrode formed in the substrate.
 2. A semiconductor device as set forth in claim 1, wherein the impurity is an impurity suppressing the grain growth of the conductive material.
 3. A semiconductor device as set forth in claim 1, wherein the impurity is oxygen, nitrogen, or boron.
 4. A semiconductor device as set forth in claim 1, wherein the conductive layer has the layer comprised of a conductive material containing impurity having different concentrations in a depth direction and having the work function near the substantial center of the energy band gap of the substrate material.
 5. A semiconductor device as set forth in claim 1, wherein the conductive layer has a refractory metal silicide layer or a refractory metal layer containing an impurity with different concentrations in a depth direction.
 6. A semiconductor device as set forth in claim 1, wherein the conductive layer has a layer comprised of a conductive material with a center region with respect to a depth direction thereof containing an impurity having a higher concentration than those of upper and lower regions thereof having the work function near the substantial center of the energy band gap of a substrate material.
 7. A semiconductor device as set forth in claim 1, wherein the conductive layer has a refractory metal silicide layer or a refractory metal layer with a center region with respect to a depth direction thereof containing an impurity having a higher concentration than those of upper and lower regions thereof.
 8. A semiconductor device as set forth in claim 1, wherein the conductive layer contains two or more types of impurities.
 9. A semiconductor device as set forth in claim 8, wherein at least one of the two or more types of impurities is oxygen, nitrogen, or boron.
 10. A semiconductor device as set forth in claim 8, wherein the conductive layer contains each of the two or more types of impurities in concentrations of 1×10¹⁹/cm³ to 1×10²¹/cm³.
 11. A semiconductor device as set forth in claim 1, wherein the substrate material is silicon and the conductive material is a refractory metal silicide or a refractory metal.
 12. A semiconductor device as set forth in claim 11, wherein the refractory metal silicide is one, two or more types selected from a group consisting of tungsten silicide (WSi_(x)), molybdenum silicide (MoSi_(x)), tantalum silicide (TaSi_(x)), and titanium silicide (TiSi_(x)).
 13. A semiconductor device as set forth in claim 11, wherein the refractory metal is one, two or more types selected from a group consisting of tungsten (W), tantalum (Ta), and titanium (Ti).
 14. A semiconductor device comprising: a silicon substrate, a gate insulating film formed in the silicon substrate, a gate electrode formed on the gate insulating film and having at least a part in contact with the gate insulating film made of a refractory metal silicide layer containing an impurity or a refractory metal layer containing an impurity, and a takeout electrode formed in the silicon substrate.
 15. A semiconductor device as set forth in claim 14, wherein the impurity is an impurity suppressing the grain growth of the refractory metal silicide or the refractory metal.
 16. A semiconductor device as set forth in claim 14, wherein the refractory metal silicide or the refractory metal contains an impurity with different concentrations in a depth direction.
 17. A semiconductor device as set forth in claim 14, wherein the refractory metal silicide layer or the refractory metal layer contains an impurity having a higher concentration in a center region with respect to a depth direction thereof than those of upper and lower regions thereof.
 18. A semiconductor device as set forth in claim 14, wherein the impurity is oxygen, nitrogen, or boron.
 19. A semiconductor device as set forth in claim 14, wherein the refractory metal silicide layer or the refractory metal layer contains two or more types of impurities.
 20. A semiconductor device as set forth in claim 19, wherein at least one of the two or more types of impurities is oxygen, nitrogen, or boron.
 21. A semiconductor device as set forth in claim 19, wherein the refractory metal silicide layer or the refractory metal layer contains each of the two or more types of impurities in concentrations of 1×10¹⁹/cm³ to 1×10²¹/cm³.
 22. A semiconductor device as set forth in claim 14, wherein the refractory metal silicide is one, two or more types selected from a group consisting of tungsten silicide (WSi_(x)), molybdenum silicide (MoSi_(x)), tantalum silicide (TaSi_(x)), and titanium silicide (TiSi_(x)).
 23. A semiconductor device as set forth in claim 14, wherein the refractory metal is one, two or more types selected from a group consisting of tungsten (W), tantalum (Ta), and titanium (Ti).
 24. A method for producing a semiconductor device comprising steps of: forming an insulating film in a substrate, forming a conductive layer made of a conductive material having a work function near a substantive center of an energy band gap of the substrate material on the insulating film, doping an impurity into the conductive layer, and forming a takeout electrode in the substrate.
 25. A method for producing a semiconductor device as set forth in claim 24, wherein the step of doping the impurity into the conductive layer has a step of doping the impurity into the conductive layer by an ion implantation process.
 26. A method for producing a semiconductor device as set forth in claim 24, wherein the step of doping the impurity into the conductive layer has a step of forming a conductive film containing the impurity on the insulating film by a chemical vapor deposition process.
 27. A method for producing a semiconductor device as set forth in claim 24, wherein the step of doping the impurity into the conductive layer has a step of doping into the conductive layer a impurity suppressing a grain growth of the conductive layer.
 28. A method for producing a semiconductor device as set forth in claim 24, wherein the step of doping the impurity into the conductive layer has a step of doping into the conductive layer the impurity so that an impurity concentration varies in a depth direction.
 29. A method for producing a semiconductor device as set forth in claim 24, wherein the step of doping the impurity into the conductive layer has a step of doping the impurity so that a concentration of the impurity contained in a center region of the conductive layer with respect to a depth direction thereof becomes higher than impurity concentrations of upper and lower regions thereof.
 30. A method for producing a semiconductor device as set forth in claim 24, wherein the step of doping the impurity into the conductive layer has a step of doping oxygen, nitrogen, or boron into the conductive layer.
 31. A method for producing a semiconductor device as set forth in claim 24, wherein the step of doping the impurity into the conductive layer has a step of doping two or more types of impurities into the conductive layer.
 32. A method for producing a semiconductor device as set forth in claim 31, wherein the step of doping the impurity into the conductive layer has a step of doping at least oxygen, nitrogen, or boron into the conductive layer.
 33. A method for producing a semiconductor device as set forth in claim 31, wherein the step of doping the impurity into the conductive layer has a step of doping each of the two or more types of impurities into the conductive layer with the concentration of 1×10¹⁹/cm³ to 1×10²¹/cm³.
 34. A method for producing a semiconductor device as set forth in claim 24, wherein a silicon substrate is used as the substrate.
 35. A method for producing a semiconductor device as set forth in claim 31, wherein the step of forming the conductive layer made of the conductive material having the work function near the substantive center of the energy band gap of the substrate material has a step of forming a refractory metal silicide layer or a refractory metal layer on the substrate.
 36. A method for producing a semiconductor device as set forth in claim 35, wherein the step of forming the refractory metal silicide layer has a step of forming a layer made of one, two or more types selected from a group consisting of tungsten silicide (WSi_(x)), molybdenum silicide (MoSi_(x)), tantalum silicide (TaSi_(x)), and titanium silicide (TiSi_(x)).
 37. A method for producing a semiconductor device as set forth in claim 35, wherein the step of forming the refractory metal layer has a step of forming a layer made of one, two or more types selected from a group consisting of tungsten (W), tantalum (Ta), and titanium (Ti).
 38. A method for producing a semiconductor device comprising steps of: forming a gate insulating film in a silicon substrate, forming a conductive layer made of a conductive material having a work function of a substantial center of an energy band gap of the silicon on the gate insulating film, doping an impurity into the conductive layer, forming a gate electrode by processing the conductive layer, and forming a takeout electrode in the silicon substrate.
 39. A method for producing a semiconductor device as set forth in claim 38, wherein the step of doping the impurity into the conductive layer has a step of doping the impurity into the conductive layer by an ion implantation process.
 40. A method for producing a semiconductor device as set forth in claim 38, wherein the step of doping the impurity into the conductive layer has a step of forming a conductive film containing the impurity on the insulating film by a chemical vapor deposition process.
 41. A method for producing a semiconductor device as set forth in claim 38, wherein the step of doping the impurity into the conductive layer has a step of doping into the conductive layer a impurity suppressing a grain growth of the conductive layer.
 42. A method for producing a semiconductor device as set forth in claim 38, wherein the step of doping the impurity into the conductive layer has a step of doping into the conductive layer the impurity so that an impurity concentration varies in a depth direction.
 43. A method for producing a semiconductor device as set forth in claim 38, wherein the step of doping the impurity into the conductive layer has a step of doping the impurity so that a concentration of the impurity contained in a center region of the conductive layer with respect to a depth direction thereof becomes higher than impurity concentrations of upper and lower regions thereof.
 44. A method for producing a semiconductor device as set forth in claim 38, wherein the step of doping the impurity into the conductive layer has a step of doping oxygen, nitrogen, or boron into the conductive layer.
 45. A method for producing a semiconductor device as set forth in claim 38, wherein the step of doping the impurity into the conductive layer has a step of doping two or more types of impurities into the conductive layer.
 46. A method for producing a semiconductor device as set forth in claim 45, wherein the step of doping the impurity into the conductive layer has a step of doping at least oxygen, nitrogen, or boron into the conductive layer.
 47. A method for producing a semiconductor device as set forth in claim 45, wherein the step of doping the impurity into the conductive layer has a step of doping each of the two or more types of impurities into the conductive layer with the concentration of 1×10¹⁹/cm³ to 1×10²¹/m³.
 48. A method for producing a semiconductor device as set forth in claim 38, wherein the step of forming the conductive layer made of the conductive material having the work function near the substantive center of the energy band gap of the substrate material has a step of forming a refractory metal silicide layer or a refractory metal layer on the substrate.
 49. A method for producing a semiconductor device as set forth in claim 48, wherein the step of forming the refractory metal silicide layer has a step of forming a layer made of one, two or more types selected from a group consisting of tungsten silicide (WSi_(x)), molybdenum silicide (MoSi_(x)), tantalum silicide (TaSi_(x)), and titanium silicide (TiSi_(x)).
 50. A method for producing a semiconductor device as set forth in claim 48, wherein the step of forming the refractory metal layer has a step of forming a layer made of one, two or more types selected from a group consisting of tungsten (W), tantalum (Ta), and titanium (Ti). 